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Bump Process
 

 

 
 
 
Technology
 

Electrolytic plating technology has been identified by the bumping industry to have the following advantages:

  • High reliability
  • Fine pitch capability
  • Flexible thickness & composition combination
  • Low cost compared to C4 process
  • Capable of high volume through-put

TLMI's bumping process combines advanced electroplating technology with a reliable and consistent process to produce the highest quality products to it's customers.

 

Bump Process

 

Incoming / Pre Clean
Sputter
Resist Coating
Align / Expose
Plate
Strip
Etch, Reflow or Anneal
Final Inspection

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