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To become a world-class leader in wafer bumping and flip chip interconnect technology by providing superior customer service and uncompromised quality. These aspirations are centered around the highest principles of business ethics and integrity.
- Employee owned
- Established
in September of 2002
- Highly experienced engineering and management staff
- Corporate headquarters and factory location:
Corporate Headquarters & Factory Location
2111 W. Braker Lane, #500
Austin, TX 78758-4054 |
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Main
Phone
(512) 833-7075 |
Main
Fax
(512) 833-7283 |
E-mail
info@tlmicorp.com |
URL
www.tlmicorp.com |
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Quality is a given
- High quality process
- Monitor data collected for process parameters
- SPC control for key process steps
- Closed loop corrective / preventive action system
- Internal audits to maximize quality improvements and monitor corrective action system
Unparalleled Customer Service
- On site resources for mask layout and procurement
- We
keep you in touch with progress of your material in process
- Non-captive, customer driven, partnership concept
Consistent, Stable Production Capabilities and Advanced Developement Capabilities
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