Rely on TLMI

When you are looking for quality and dependability, rely on TLMI as your full-service wafer bumping partner. We use advanced electroplating bumping techniques, offering gold, solder, indium, redistribution and our unique copper bumping, as well as mask layout, backgrinding, dicing and pick & place services. Our advanced plating technology allows for fine pitch bumping under 100 micron and 150 micron tall copper bumping.

TLMI, strategically located in Austin, TX, is dedicated to delivering the highest customer satisfaction and most advanced technology in end-to-end, turn key wafer flip chip fabrication services in North America. The focus of our Austin facility is on prototype development of all types of bumping requirements, initial production ramps, and specialty bumping and flip chip interconnect applications that require a high degree of engineering skill. TLMI can help with transferring your device to any high volume wafer bumping company.

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To learn more, call our office at 512-833-7075. Rely on TLMI