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Gold Bumping Guidelines
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Layout Guidelines
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Gold Bumps
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| 1 |
Bump Height Average |
18 µm & 25 µm std. (Capability: 2-30 µm) |
| 2 |
Bump Height Uniformity |
+/- 1 µm (in die), +/- 2 µm (in wafer), +/- 3µm (wf to wf) |
| 3 |
Bump Pitch |
50 µm Minimum |
| 4 |
Bump Spacing |
20 µm Minimum |
| 5 |
Bump to Pass. Overlap |
7 µm Per Side Minimum
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| 6 |
Edge of Bump to Al |
7 µm Per Side Minimum |
| 7 |
Passivation Opening |
16 µm Minimum |
| 8 |
Passivation Angle of Slope |
>
60 Degrees |
| 9 |
Passivation Type |
Nitride, OxyNitride, Polyimide |
| 10 |
Wafer Edge Exclusion |
3mm
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| 11 |
Bump Mask Design and Layout |
TLMI
In-house Design Capability: Require GDSII, Stepping Distance,
Wafer Map |
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Bump Specifications
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Gold Bumps
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| 1 |
Bump Material |
99.9+% pure Gold |
| 2 |
Bumping Method |
Electroplating |
| 3 |
UBM Material |
Ti/W |
| 4 |
UBM Deposition Method |
Sputtering |
| 5 |
Bump Shear Strength |
> 5.6g/mil2 |
| 6 |
Bump Hardness |
35 - 75 Knoop (Annealed)
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