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Pad Redistribution
Process Diagram
Layout Guidelines
| Minimum Opening |
30µm |
Minimum Overlap
(Inside Existing Passivation) |
10µm per side |
Minimum Overlap
(Outside Via 1 Passivation) |
10µm per side |
| Minimum trace width |
25µm |
| Minimum trace spacing |
25µm |
Recommended Cu pad size
(Pad should be round, polygon, or octagon shaped) |
Minimum
100µm
|
Minimum overlap
(Inside plated Cu pad) |
20µm per side |
Recommended terminal via opening
(Opening should be round, polygon, or octagon shaped) |
Minimum
40µm diameter |
Minimum overlap
(Outside Via 2 passivation ) |
20µm per side |
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