|
|
Design
Guidelines |
Copper
Bumps (Solder, Nickel, Gold or Indium Cap) |
| 1 |
Bump
Height Average |
100m(10m to 150m available) |
| 2 |
Bump
Height Uniformity |
±5m
(in die); ±15um (in wafer); ±20m (wfr to wfr)
|
| 3 |
Bump
Pitch |
150um
Standard (Bump Height Dependant) |
| 4 |
Bump
Spacing |
75µm
Minimum (Bump Height Dependant) |
| 5 |
Bump
to Passivation Overlap |
7µm
Per Side Minimum |
| 6 |
Pad
to Bump Overlap |
7µm
Per Side Minimum |
| 7 |
Passivation
Opening |
40µm
Minimum |
| 8 |
Cap
Height |
2-50um
(Before Reflow) |
| 9 |
Passivation
Angle of Slope |
>
60 Degrees |
| 10 |
Passivation
Type |
Nitride,
OxyNitride, Polyimide |
| 11 |
Passivation
Height |
0.5-1.8
um |
| 12 |
Wafer
Edge Exclusion Zone |
3mm |
| 13 |
Mask
design and Layout |
Requires
GDSII or ACAD, Stepping Distance Wafer Map |
| |
|
|
| |
Specifications |
Copper
Bumps (Solder, Nickel, Gold or indium Cap) |
| 1 |
Bump
Height Uniformity |
±5m
(in die); ±15m (in wafer); ±20m (wfr to wfr) |
| 2 |
Copper
Shear Strength |
>12
grams/mil2 |
| 3 |
Voids |
<10%
of Bump Volume, No Exposed Pad |
| 4 |
Missing
Bumps |
None
Outside Exclusion Area |
