|
|
Design Guidelines
|
Solder Bumps (Eutectic or High Lead)
|
| 1 |
Standard Bump Height |
100
µm (Available: 25µm - 400µm) |
| 2 |
Bump Height Uniformity |
+/- 5µm (in die), +/- 10µm (in wafer) |
| 3 |
Bump Pitch |
150 µm Standard ( Fine Pitch Available = 100 µm) |
| 4 |
Bump Spacing |
75 µm Std. |
| 5 |
Bump to Pass. Overlap |
7 µm Per Side Minimum |
| 6 |
Edge of Bump to Al |
7 µm Per Side Minimum |
| 7 |
Passivation Opening |
60 µm |
| 8 |
Passivation Angle of Slope |
>
60 Degrees |
| 9 |
Passivation Type |
Nitride, OxyNitride, Polyimide |
| 10 |
Wafer Edge Exclusion Zone |
3mm From Wafer Edge |
| 11 |
Bump Mask Design and Layout |
TLMI
In-House Design Capability: Require GDSII, Stepping Distance,
Wafer Map |
