TLMI Corporation
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Pad Redistribution (RDL)
RDL Layout Guidelines for wafer level chip scale packaging VIA 1 Repassivation Minimum... -
Copper Bumping
Layout Guidelines Copper Bumps (Solder, Nickel, Gold or Indium Cap) 1 Bump Height... -
Indium Bumping
Layout Guidelines Indium Bumps 1 Bump Height Average 35 µm std. (Capability: 5-50... -
Other Services
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Gold Bumping
Layout Guidelines Gold Bumps 1 Bump Height Average 18 µm & 25 µm... -
Solder Bumping
Layout Guidelines Solder Bumps 1 Standard Bump Height 100 µm (Available: 15 –...