 Electrolytic plating technology has been identified by the bumping industry to have the following advantages:
- High reliability
- Fine pitch capability
- Flexible thickness & composition combination
- Low cost compared to C4 process
- Capable of high volume through-put
 TLMI’s bumping process combines advanced electroplating technology with a reliable and consistent process to deliver the highest quality products to our customers.
Wafer Bumping Process
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